我的購物車0
購物車中還沒有商品,趕快選購吧!
首頁 > Samtec代理商 > TSW-110-08-S-D-RA
TSW-110-08-S-D-RA
影像僅供參考,以產品規格為準

TSW-110-08-S-D-RA

型號描述:
TSW - Samtec 2.54mm Right Angle Through Hole Header 2.29mm Solder Tail (08) - Fast Stock(mc)
型號:
TSW-110-08-S-D-RA
品牌:
Samtec
交期:
10-15工作天
原廠包裝量:
1+¥42.672
50+¥34.832
100+¥29.568
500+¥26.32
1000+¥19.488
2000+¥17.248
5000+¥12.768
14708+¥8.176
39751+¥7.616
85949+¥7.056
起訂量:1倍增量:1
價格:¥42.672數量:

合計:¥42.67

Series
TSW
Packaging
Bulk
Part Status
Active
Connector Type
Header
Contact Type
Male Pin
Pitch - Mating
0.100" (2.54mm)
Number of Positions
20
Number of Rows
2
Row Spacing - Mating
0.100" (2.54mm)
Number of Positions Loaded
All
Style
Board to Board or Cable
Shrouding
Unshrouded
Mounting Type
Through Hole, Right Angle
Termination
Solder
Fastening Type
Push-Pull
Contact Length - Mating
0.230" (5.84mm)
Contact Length - Post
0.090" (2.29mm)
Overall Contact Length
-
Insulation Height
0.219" (5.56mm)
Contact Shape
Square
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Finish - Post
Tin
Contact Material
Phosphor Bronze
Insulation Material
Polybutylene Terephthalate (PBT)
Features
-
Operating Temperature
-55°C ~ 125°C
Ingress Protection
-
Material Flammability Rating
UL94 V-0
Insulation Color
Black
Current Rating (Amps)
-
Voltage Rating
-
Mated Stacking Heights
-
Contact Finish Thickness - Post
-
Applications
-
  • 精選品牌
    • Samsung
    • ADI
    • Murata11
    • Amphenol
    • Roving
    • Walsin
    • Panasonic
    • TE
    • United-Chemi-Con
    • Molex
    • Nichicon
    • Microchip
    • Bourns
    • ROHM
    • AVX
    • Catalyst
    • ST
    • NXP
    • Vishay
    • KEMET
    • TDK
    • FTDI
    • HARTING
    • Mean Well
    • BroadcomLimited
    • Eaton
    • Microsemi
    • Atmel
    • JST
    • Agilent
      • 資訊中心