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396-2AB
影像僅供參考,以產品規格為準

396-2AB

型號描述:
BOARD LEVEL HEAT SINK - LOW PROFILE PERFORMANCE HEAT SINK FOR IGBTS & POWER MODULES
型號:
396-2AB
品牌:
Wakefield-Vette
交期:
10-15工作天
原廠包裝量:
53+NT$1495.065
176+NT$1090.635
352+NT$1060.8
起訂量:1倍增量:1
價格:NT$1495.065數量:

合計:NT$1495

Part Status
Active
Type
Board Level, Extrusion
Package Cooled
Power Modules
Attachment Method
Bolt On
Shape
Rectangular, Fins
Length
5.500" (139.70mm)
Width
5.000" (127.00mm)
Diameter
-
Height Off Base (Height of Fin)
1.382" (35.10mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
0.60°C/W @ 500 LFM
Thermal Resistance @ Natural
1.50°C/W
Material
Aluminum
Material Finish
Black Anodized
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