我的購物車0
購物車中還沒有商品,趕快選購吧!
首頁 > Samtec代理商 > TSW-103-07-T-S
TSW-103-07-T-S
影像僅供參考,以產品規格為準

TSW-103-07-T-S

型號描述:
Board Connector, 3 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Black nt, Silicon, DO-214AA
Conn Unshrouded Header HDR 3 POS 2.54mm Solder ST Top Entry Thru-Hole Bag
型號:
TSW-103-07-T-S
品牌:
Samtec
交期:
10-15工作天
原廠包裝量:
1+¥2.688
250+¥2.128
1000+¥1.68
5000+¥1.456
25000+¥1.12
50000+¥0.896
100000+¥0.672
282000+¥0.448
762250+¥0.448
1648250+¥0.336
起訂量:1倍增量:1
價格:¥2.688數量:

合計:¥2.69

Series
HTSW
Packaging
Bag
Part Status
Active
Connector Type
Header
Contact Type
Male Pin
Pitch - Mating
0.100" (2.54mm)
Number of Positions
3
Number of Rows
1
Row Spacing - Mating
-
Number of Positions Loaded
All
Style
Board to Board or Cable
Shrouding
Unshrouded
Mounting Type
Through Hole
Termination
Solder
Fastening Type
Push-Pull
Contact Length - Mating
0.230" (5.84mm)
Contact Length - Post
0.100" (2.54mm)
Overall Contact Length
0.430" (10.92mm)
Insulation Height
0.100" (2.54mm)
Contact Shape
Square
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
-
Contact Finish - Post
Tin
Contact Material
Phosphor Bronze
Insulation Material
Liquid Crystal Polymer (LCP)
Features
-
Operating Temperature
-55°C ~ 105°C
Ingress Protection
-
Material Flammability Rating
UL94 V-0
Insulation Color
Natural
Current Rating (Amps)
Varies by Wire Gauge
Voltage Rating
-
Mated Stacking Heights
-
Contact Finish Thickness - Post
-
Applications
-
Base Part Number
HTSW-103
  • 精選品牌
    • Samsung
    • ADI
    • Murata11
    • Amphenol
    • Roving
    • Walsin
    • Panasonic
    • TE
    • United-Chemi-Con
    • Molex
    • Nichicon
    • Microchip
    • Bourns
    • ROHM
    • AVX
    • Catalyst
    • ST
    • NXP
    • Vishay
    • KEMET
    • TDK
    • FTDI
    • HARTING
    • Mean Well
    • BroadcomLimited
    • Eaton
    • Microsemi
    • Atmel
    • JST
    • Agilent
      • 資訊中心