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首頁 > Malico Inc.代理商 > MBA33002-21P/CU/3.4Y
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MBA33002-21P/CU/3.4Y

型號描述:
Heat Sink BGA Copper Top Mount
CU HEAT SINK 33X33X21MM WITH PIN
型號:
MBA33002-21P/CU/3.4Y
品牌:
Malico Inc.
交期:
5-8工作天
原廠包裝量:
1+NT$210.779
10+NT$186.513
25+NT$177.663
50+NT$171.244
100+NT$165.056
250+NT$157.202
500+NT$151.507
1000+NT$146.011
起訂量:1 倍增量:1
價格: NT$210.779 數量:

合計: NT$211

Type
Top Mount
Package Cooled
BGA
Attachment Method
Clip
Shape
Square, Pin Fins
Length
1.299" (33.00mm)
Width
1.299" (33.00mm)
Diameter
-
Fin Height
0.709" (18.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
-
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