18-822-90C
- 型號描述:
-
18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole, Right Angle, Horizontal
CONN IC DIP SOCKET 18POS GOLD
- 型號:
- 18-822-90C
- 品牌:
- Aries Electronics
- 交期:
- 5-8工作天
- 原廠包裝量:
- 1
- Type
- DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid)
- 18 (2 x 9)
- Pitch - Mating
- 0.100" (2.54mm)
- Contact Finish - Mating
- Gold
- Contact Finish Thickness - Mating
- 30.0µin (0.76µm)
- Contact Material - Mating
- Beryllium Copper
- Mounting Type
- Through Hole, Right Angle, Horizontal
- Features
- Closed Frame
- Termination
- Solder
- Pitch - Post
- 0.100" (2.54mm)
- Contact Finish - Post
- Tin
- Contact Finish Thickness - Post
- 200.0µin (5.08µm)
- Contact Material - Post
- Brass
- Housing Material
- Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature
- -55°C ~ 105°C
- 精選品牌
- 熱銷產品
- PZS51A5V1CS_R1_00001
- LTC7891RUFDM#PBF
- 323161
- M24308/3-2F
- R5F513T3AGNH#20
- LTC6255HS6#TRMPBF
- ADN4624BRNZ
- LT3029EMSE#TRPBF
- 30DRPS4E(D)
- 30DRPS4E
- DF63W-2EP-3.96C
- PJW8N03_R2_00001
- W25Q32JVSSIM
- WIG-16300
- M6-21-427
- 10169891-453001SLF
- AFB0924SH-AF00
- MS27473T12F98PA
- ASL5115SHNZ
- 4922R-08L
- RJFC2ZN
- HCPL-4502-500E
- EEU-FS1A821B
- CRCW1210105RFKEA
- LQM21PN2R2MGSD
- 1SMB3EZ24_R1_00001
- DN01508D
- RC0805FR-0726K7L
- DAR71210
- DAR71210
- DAR71210
- DAR71210
- FDA117GRTR
- MP1653AGTF-Z
- DUA55CM44
- RT6263BHGJ8F
- SD24C-7
- RC0402FR-0736K5P
- 431256083726
- RG2012P-101-B-T5
- 猜你喜歡
- 18-6625-51
- 18-981.4L
- 18-952.5
- 18-952.4
- 18-952.8
- 18-6513-10
- 18-024-207
- 18-012-207
- 18-9625-11
- 18-8670-610C
- 18-3625-20
- 18-820-90TWR
- 18-822-90E
- 18-823-90T
- 18-8250-310C
- 18-823-90
- 18-822-90EWR
- 18-822-90
- 18-820-90C
- 18-822-90C
- 18-820-90
- 18-820-90T
- 18-822-90T
- 18-823-90C
- 18-3625-70
- 18-3625-71
- 18-501-30
- 18-501-21
- 18-501-20
- 18-501-31
- 18-012-117
- 18-008-117
- 18-225/S2G6C-A01/3T
- 18-024-117
- 18-910
- 18-9574-0079
- 18-253
- 18-951.2
- 18-952.2
- 18-7625-10
- 資訊中心
- onsemi 推出基於第七代 IGBT 的智慧功率模組，以降低加熱和冷卻能耗
- 2024-03-16
- Samtec 開設新台灣設計中心
- 2023-11-13
- TI 利用 SiC 柵極驅動器幫助最大限度地提高電動汽車的行駛里程
- 2023-08-12
- 新型 TE Connectivity 連接器幫助汽車 OEM 減小組件尺寸和重量
- 2022-10-09
- TDK 為 ADAS/AD 電源管理提供極其緊湊和可靠的 CLT 功率電感器
- 2022-08-13
- 意法半導體觸控控制器支持新一代AMOLED節能顯示器
- 2022-07-03
- ADI 公司的無線電池管理系統獲得頂級汽車網絡安全認證
- 2022-04-09
- 通過 Samtec 和 SnapEDA 提供 20 萬多個互連符號和封裝
- 2021-11-13
- TE Connectivity 的新型可插拔連接器滿足了照明應用的市場需求
- 2021-07-04
- 意法半導體的低電容汽車瞬態電壓抑制器為高速接口提供保護
- 2021-05-30
- ROHM新型600V IGBT IPM提供領先的低噪聲，低損耗
- 2021-05-08
- Littelfuse收購Hartland Controls
- 2021-04-05
- Molex推出了汽車主動降噪中的重大傳感器創新，以改善安全性和駕駛體驗
- 2021-02-24
